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Fundamentals of Heat and Mass Transfer 8th Edition Solutions

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Sandra Watson
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PROBLEM 1.1
KNOWN: Thermal conductivity, thickness and temperature difference across a sheet of rigid
extruded insulation.
FIND: (a) The heat flux through a 2 m × 2 m sheet of the insulation, and (b) The heat rate
through the sheet.

PROBLEM 1.2
K
NOWN: Inner surface temperature and thermal conductivity of a concrete wall.
FIND: Heat loss by conduction through the wall as a function of outer surface temperatures ranging from
-15 to 38°C.

PROBLEM 1.3
KNOWN: Dimensions, thermal conductivity and surface temperatures of a concrete slab. Efficiency
of gas furnace and cost of natural gas.
F
IND: Daily cost of heat loss.

PROBLEM 1.4
KNOWN: Heat flux and surface temperatures associated with a wood slab of prescribed
thickness.
FIND: Thermal conductivity, k, of the wood.

PROBLEM 1.5
KNOWN: Inner and outer surface temperatures of a glass window of prescribed dimensions.
FIND: Heat loss through window.

PROBLEM 1.6
KNOWN: Width, height, thickness and thermal conductivity of a single pane window and
the air space of a double pane window. Representative winter surface temperatures of single
pane and air space.
F
IND: Heat loss through single and double pane windows.

PROBLEM 1.7
KNOWN: Dimensions of freezer compartment. Inner and outer surface temperatures.
FIND: Thickness of styrofoam insulation needed to maintain heat load below prescribed
value.

PROBLEM 1.8
KNOWN: Dimensions and thermal conductivity of food/beverage container. Inner and outer
surface temperatures.
F
IND: Heat flux through container wall and total heat load.

PROBLEM 1.9
KNOWN: Masonry wall of known thermal conductivity has a heat rate which is 80% of that
through a composite wall of prescribed thermal conductivity and thickness.
FIND: Thickness of masonry wall.

PROBLEM 1.10
KNOWN: Thickness, diameter and inner surface temperature of bottom of pan used to boil
water. Rate of heat transfer to the pan.
F
IND: Outer surface temperature of pan for an aluminum and a copper bottom.

PROBLEM 1.11
KNOWN: Dimensions and thermal conductivity of a chip. Power dissipated on one surface.
FIND: Temperature drop across the chip.

PROBLEM 1.12
KNOWN: Heat flux gage with thin-film thermocouples on upper and lower surfaces; output
voltage, calibration constant, thickness and thermal conductivity of gage.
F
IND: (a) Heat flux, (b) Precaution when sandwiching gage between two materials.

PROBLEM 1.13
K
NOWN: Hand experiencing convection heat transfer with moving air and water.
FIND: Determine which condition feels colder. Contrast these results with a heat loss of 30 W/m2 under
normal room conditions.

PROBLEM 1.14
KNOWN: Power required to maintain the surface temperature of a long, 25-mm diameter cylinder
with an imbedded electrical heater for different air velocities.
FIND: (a) Determine the convection coefficient for each of the air velocity conditions and display the
results graphically, and (b) Assuming that the convection coefficient depends upon air velocity as h =
CV
n, determine the parameters C and n.

PROBLEM 1.15
KNOWN: Long, 30mm-diameter cylinder with embedded electrical heater; power required
to maintain a specified surface temperature for water and air flows.
FIND: Convection coefficients for the water and air flow convection processes, hw and ha,
respectively.

PROBLEM 1.16
KNOWN: Dimensions of a cartridge heater. Heater power. Convection coefficients in air
and water at a prescribed temperature.
FIND: Heater surface temperatures in water and air.

PROBLEM 1.17
KNOWN: Length, diameter and calibration of a hot wire anemometer. Temperature of air
stream. Current, voltage drop and surface temperature of wire for a particular application.
F
IND: Air velocity

PROBLEM 1.18
K
NOWN: Chip width and maximum allowable temperature. Coolant conditions.
F
IND: Maximum allowable chip power for air and liquid coolants.

PROBLEM 1.19
KNOWN: Length, diameter and maximum allowable surface temperature of a power
transistor. Temperature and convection coefficient for air cooling.
F
IND: Maximum allowable power dissipation.

PROBLEM 1.20
K
NOWN: Air jet impingement is an effective means of cooling logic chips.
F
IND: Procedure for measuring convection coefficients associated with a 10 mm × 10 mm chip.

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Fundamentals of Heat and Mass Transfer 8th Edition Solutions

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